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Design and Characterization of Integrated Varactors for RF Applications

射频应用手册：集成变容二极管设计与特性化

ISBN：9780470025871，出版年：2007，中图分类号：TN

Varactors are passive semiconductor devices used in electronic circuits, as a voltage-controlled way of storing energy in order to boost the amount of electric charge produced. In the past, the use of low-cost fabrication processes such as complementary metal oxide semiconductor (CMOS) and silicon germanium (SiGe) were kept for integrated circuits working in frequency ranges below the GHz. Now, the increased working frequency of radio frequency integrated circuits (RF ICs) for communication devices, and the trend of system-on-chip technology, has pushed the requirements of varactors to the limit. As the frequency of RF applications continues to rise, it is essential that passive devices such as varactors are of optimum quality, making this a critical design issue. Initially describing the physical phenomena that occur in passive devices within standard IC fabrication processes, Design and Characterization of Integrated Varactors for RF Applications goes on to: present information on the design of wide band electrical varactor models (up to 5 GHz) which enable the accurate prediction of device performance; propose a specific methodology for the measurement of integrated varactors, covering on-wafer measurement structures, the calibration process, and detailed descriptions of the required equipment; explain de-embedding techniques and also analyse confidence level and uncertainty linked to the test set-up; examine the design of a voltage controlled oscillator (VCO) circuit as a practical example of the employment of methods discussed in the book. Providing the reader with the necessary technical knowledge for dealing with challenging VCO designs, this book is an essential guide for practising RF and microwave engineers working on the design of electronic devices for integrated circuits. It is also a useful reference for postgraduate students and researchers interested in electronic design for RF applications.

Application-specific integrated circuit Integrated circuit design Joint application design Integrated design Projective integration Feature based design Integrated project delivery Design specification Central composite design Fractional factorial design

Transient-Induced Latchup in CMOS Integrated Circuits

CMOS 集成电路暂态触发闩锁效应

Wiley Ming-Dou Ker Sheng-Fu Hsu

ISBN：9780470824078，出版年：2009，中图分类号：TM

The book all semiconductor device engineers must read to gain a practical feel for latchup-induced failure to produce lower-cost and higher-density chips. Transient-Induced Latchup in CMOS Integrated Circuits equips the practicing engineer with all the tools needed to address this regularly occurring problem while becoming more proficient at IC layout. Ker and Hsu introduce the phenomenon and basic physical mechanism of latchup, explaining the critical issues that have resurfaced for CMOS technologies. Once readers can gain an understanding of the standard practices for TLU, Ker and Hsu discuss the physical mechanism of TLU under a system-level ESD test, while introducing an efficient component-level TLU measurement setup. The authors then present experimental methodologies to extract safe and area-efficient compact layout rules for latchup prevention, including layout rules for I/O cells, internal circuits, and between I/O and internal circuits. The book concludes with an appendix giving a practical example of extracting layout rules and guidelines for latchup prevention in a 0.18-micrometer 1.8V/3.3V silicided CMOS process. Presents real cases and solutions that occur in commercial CMOS IC chips Equips engineers with the skills to conserve chip layout area and decrease time-to-market Written by experts with real-world experience in circuit design and failure analysis Distilled from numerous courses taught by the authors in IC design houses worldwide The only book to introduce TLU under system-level ESD and EFT tests This book is essential for practicing engineers involved in IC design, IC design management, system and application design, reliability, and failure analysis. Undergraduate and postgraduate students, specializing in CMOS circuit design and layout, will find this book to be a valuable introduction to real-world industry problems and a key reference during the course of their careers.

Integrated circuit Application-specific integrated circuit Integrated circuit packaging Integrated circuit design Integrated circuit card Three-dimensional integrated circuit Charge-transfer complex Intracellular signal transduction pathway Macromolecular assembly Path integration