Lead Finishing In Semiconductor Devices: Soldering

ISBN: 9789971506797 出版年：1989 页码：269 Ng Ah Chin A C Tan World Scientific Publishing Company

This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly.