3D Integration for VLSI Systems

ISBN: 9789814303811 出版年：2016 页码：376 Jenny Stanford Publishing

3D Integration Technology - Introduction and Overview Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For? Phil Emma and Eren Kursun Wafer Bonding Techniques Bioh Kim, Thorsten Matthias, Viorel Dragoi, Markus Wimplinger and Paul Lindner TSV Etching Paul Werbaneth TSV Filling Arthur Keigler 3D Technology Platform: Temporary Bonding and Release Mark Privett 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling Scott Sullivan Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi Advanced Direct Bond Technology Paul Enquist Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration Akitsu Shigetou Through Silicon Via Implementation in CMOS Image Sensor Product Xavier Gagnard and Nicolas Hotellier A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding Fei Liu Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells Ron Rutman and Jian Sun Thermal-Aware 3D IC Designs Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan 3D IC Design Automation Considering Dynamic Power and Thermal Integrity Hao Yu and Xiwei Huang Outlook Ya Lan