Handbook of 3D Integration, Volume 4 —— Design, Test, and Thermal Management

----- 三维集成手册 - 卷4：设计，测试和热管理

ISBN: 9783527338559 出版年：2019 页码：491 Paul D Franzon Erik Jan Marinissen Wiley

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.