11th International Congress Molded Interconnect Devices – Scientific Proceedings

Name: 11th International Congress Molded Interconnect Devices – Scientific Proceedings
Rating: 3.94
ISBN: 9783038352525

ISBN: 9783038352525 出版年：2014 页码：134 Trans Tech Publications Ltd

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内容简介

A collection of selected, peer reviewed papers from the 11th international congress molded interconnect devices (MID 2014), september 24-25, 2014, nuremberg / fuerth, germany.

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