Rapid Thermal Processing and beyond: Applications in Semiconductor Processing

ISBN: 9780878493913 出版年：2008 页码：427 Trans Tech Publications Ltd

Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.This special-topic book, “Rapid Thermal Processing and Beyond: - Applications in Semiconductor Processing” focuses on various aspects of Rapid Thermal and Millisecond Annealing and is arranged so as to follow the major processing steps involved in high-performance transistor fabrication, without claiming to be a complete catalogue of all of the Rapid Thermal Processing (RTP) steps currently in use.Starting with the silicon wafer-material itself and emphasizing various aspects of devices, from advanced gate dielectrics to source/drain engineering, the issue ends with a summary of fully silicided gates. Moreover, thermal processing development over the past 30 years is highlighted for full-wafer millisecond annealing, laser annealing and high-volume production RTP systems. The latest insights into surface cleaning for nano-technology as well as Secondary Ion Mass Spectrometry are also discussed.