32in full high definition display devices based on back-channel etch IGZO TFTs were prepared. The mechanism of interlayer peeling defect in IGZO TFTs formation was studied. It turns out that the passivation layer was peeling with the underlying source electrode, which caused an interruption in signal transmission. Relevant process improvements were implemented, and the interlayer peeling defect in IGZO TFTs was solved.
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