Tribology In Chemical-Mechanical Planarization

ISBN: 9780367393250 出版年：2005 页码：199 Liang, Hong Craven, David CRC Press

Chemical–mechanical planarization (CMP) is one of the most important process steps in making integrated circuits. Tribology plays significant roles in material removal, polishing, and planarization. This chapter provides an introduction to CMP and discusses evolution, roles, and effects of tribology in this important industrial process. Tantalum and copper CMP are discussed here as two examples in understanding mechanisms of CMP.