Handbook of Lapping and Polishing

ISBN: 9781574446708 出版年：2006 页码：510 CRC Press

INTRODUCTION Ioan Marinescu From Craft to Science Importance of the Abrasive Problem Solving References FUNDAMENTALS OF LAPPING Eckart Uhlmann General Considerations Historical Development of Lapping Definition of Lapping and Classification of Lapping Processes Process Mechanisms and Subsurface Damage in Lapping Lapping Process as a Removal System Tool Specification Machine Settings Fundamentals of Planetary Kinematics Process Models and Simulation Symbols and Abbreviations References LAPPING OF DUCTILE MATERIALS Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku Introduction Physics of the Process Mechanism of the Process References Bibliography LAPPING OF BRITTLE MATERIALS Ioan Marinescu, Ion Benea, and Mariana Pruteanu Introduction Background Information Nontraditional Lapping Processes ELID-Lap Grinding Materials, Experimental Setup, and Testing Procedure (Study Case) Experimental Results and Discussion References Bibliography Appendix A Appendix B LAPPING AND LAPPING MACHINES Toshiro K. Doi and Daizo Ichikawa Introduction Processing Principles of Lapping and Its Characteristics Lapping Machine Both-Sides Simultaneous Lapping Machine Equipped with a New Micromotion Mechanism Conclusions POLISHING TECHNOLOGY Toshiro K. Doi Polishing Principles Processing Accuracy and Damaged Layer Polishing Machines Mechanochemical Polishing and Chemical Mechanical Polishing Noncontact Polishing Magnetoabrasive Finishing Polishing Process Applying Electrophoretic Deposition Electroabrasive Mirror Polishing Process P-MAC Polishing Colloidal Silica Polishing References CHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS Toshiro K. Doi Orientations and Role of CMP in Semiconductor Process Basic Concept of Planarization CMP Basic Technology of Planarization CMP The Study Case of Device Wafer Thin Film Magnetic Recording Heads CMP of Compound Semiconductor Wafers References INDEX