----- 功率电子模块:设计与制造
Introduction Selection Procedure Materials Insulating Substrate and Metallization Base Plate Bonding Material Power Interconnection and Terminal Encapsulant Plastic Case and Cover Manufacturing of Power IGBT Modules Manufacturing Process Process Control/Long-Term Reliability Manufacturing Facilities Manufacturing Flow Charts Design Thermal Management Circuit Partitioning Design Guidelines and Considerations Thermal Results of Different Samples
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