----- 高密度集成电子皮层神经接口
High-Density Integrated Electrocortical Neural Interfaces provides a basic understanding, design strategies and implementation applications for electrocortical neural interfaces with a focus on integrated circuit design technologies. A wide variety of topics associated with the design and application of electrocortical neural implants are covered in this book. Written by leading experts in the field Dr. Sohmyung Ha, Dr. Chul Kim, Dr. Patrick P. Mercier and Dr. Gert Cauwenberghs he book discusses basic principles and practical design strategies of electrocorticography, electrode interfaces, signal acquisition, power delivery, data communication, and stimulation. In addition, an overview and critical review of the state-of-the-art research is included. These methodologies present a path towards the development of minimally invasive brain-computer interfaces capable of resolving microscale neural activity with wide-ranging coverage across the cortical surface.Written by leading researchers in electrocorticography in brain-computer interfacesOffers a unique focus on neural interface circuit design, from electrode to interface, circuit, powering, communication and encapsulationCovers the newest ECoG interface systems and electrode interfaces for ECoG and biopotential sensing
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