Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

ISBN: 9780081025321 出版年：2019 页码：436 Zhang, Hengyun Che, Faxing LIn, Tingyu Woodhead Publishing_RM

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packagingFeatures experimental characterization and qualifications for the analysis and verification of electronic packaging designProvides multiphysics modeling and analysis techniques of electronic packaging